Home Faculty Faculty

Ming-Tzer Lin
Research Areas
MEMs, VLSI technology Nano processing, Mechanical Properties of
thin films and bioMEMs materials.
A. Journal Articles
  1. De-Shau Huang, Yi-Sheng Liao, Heng-Jen Kuo, Fang-Jui Kuo, Ming-Tzer Lin, “Simulation of a high-power LED lamp for the evaluation and design,” Microsystem Technologies, 06 2015. (SCI)
  2. YA-CHI CHENG,YU-TING WANG,FENG-CHIH HSU,FANG-CHING, “Effect of Loading Stress on the Growth of Cn/Sn Intermetallic Compounds at High Temperatures,” Journal of ELECTRONIC MATERIALS, 06 2015. (SCI)
  3. Fan-Lei Wu,Sin-Liang Ou,Yu-Cheng Kao,Chun-Li Chen,Ming-Chun, “Thin-filmvertical-type AlGaInP LEDs fabricated by epitaxial lift-off process via thepatterned design of Cu substrate.,” OPTICS EXPRESS, vol.23, no.14, pp.18156-18165, 07 2015. (SCI)
  4. Feng-Chih Hsu, Ya-Chi Cheng, Yu-Ting Wang, Ming-Tzer Lin, Chih-Ming Chen, “Planar copper-tin inter-metallic film formation on strained substrates,” Microelectronics Reliability, 02 2014. (SCI)
  5. Feng-Chih Hsu, Yu-Ting Wang, Ya-Chi Cheng, Chi-Jia Tong,and Ming-Tzer Lin, “The study of internal friction in nanocrystalline Ag and Au thin films,” Thin Solid Films, 11 2014. (SCI)
  6. Yu-Ting Wang, Chi-Jia Tong, Yun-Fu Shieh, Ya-Chi Cheng, Fan-Chun Hsieh,, “Effect of temperature on energy loss and internal friction in nanocrystalline copper thin films.,” Surface & Coatings Technology, 12 2014. (SCI)
  7. T.-C. Hu, Y.-T. Wang, F.-C. Hsu, P.-K. Sun, M.-T. Lin, “Cyclic creep and fatigue testing of nanocrystalline copper thin films,” Surface & Coatings Technology, 01 2013. (SCI)
  8. Hui Huang Cheng, De-Shau Huang, Ming-Tzer Lin, “Heat dissipation design and analysis of high power LED array using the finite element method,” Microelectronics Reliability, vol.52, 05 2012. (SCI)
  9. 陳冠綸; 童麒嘉; 王瑜婷; *林明澤, “尺度效應下金屬薄膜在槳型懸臂樑動態響應之行為與材料機械性質之探討,” 臺灣奈米會刊, 06 2012. (SCI)
  10. Taco Chen,Ming-Tzer Lin Kuan-Jung Chung, “Linear energy control of laser drilling and its application in the repair of TFT-LCD bright pixels,” Microsystem Technologies, 11 2012. (SCI)
  11. Yu-Ting Wang, Tien-Chen Hu,Chi-Jia Tong,Ming-Tzer Lin, “Novel full range vacuum pressure sensing technique using free decay of trapezoid micro-cantilever beam deflected by electrostatic force,” Microsystem Technologies, 11 2012. (SCI)
  12. TIEN-CHEN HU,FENG-CHIH HSU, AN-WEN HUANG, and MING-TZER LIN, “Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates,” Journal of ELECTRONIC MATERIALS, vol.41, no.12, pp.3309-3319, 12 2012. (SCI)
  13. Wei-Tzuo Lin, De-Shau Huang, *Ming-Tzer Lin, “The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications,” Microsystem Technologies, vol.17, pp.693-699, 04 2011. (SCI)
  14. Ya-Chi Cheng, Chi-Jia Tong, Ming-Tzer Lin, “Measurement of Static and Dynamic Mechanical Behavior of Micro and Nano-Scale Thin Metal Films: Using Micro-Cantilever Beam Deflection,” Microsystem Technologies, vol.17, pp.721-730, 04 2011. (SCI)
  15. Wen-Kai Liao, Chih-Ming Chen*, Ming-Tzer Lin and Chao-Hong Wang, “Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface,” Scripta Materialia, 08 2011. (SCI)
  16. Ming-Tzer Lin; Chi Jia Tong; Kai ‐ ‐Shiang Shiu, “Novel microtensile method for monotonic and cyclic testing of freestanding copper thin films,” Experimental Mechanics, vol.50, pp.55-64, 01 2010. (SCI)
  17. Chao-Chi Chang, De-Shau Huang, *Ming-Tzer Lin, Ray-Hua Horng, Chi-Ming Lai, “Novel Heat Dissipation Design for Light Emitting Diode Applications,” Microsystem Technologies, vol.16, no.4, pp.519-526, 04 2010. (SCI)
  18. Chi-Jia Tong, Ya-Chi Cheng, *Ming-Tzer Lin, Kuan-Jung Chung, Jiong-Shiun, “Micro-Paddle Beam Deflection Measurement for Electrostatic Mechanical Testing of Nano-Scale Thin Film Application to MEMS,” Microsystem Technologies, vol.16, 07 2010. (SCI)
  19. DE-SHAU HUANG, JIYE-SIANG SHIH, HUNG-CHIH HSIA, MING-TZER LIN, “Three-Phase Linear Motor Heat TransferAnalysis Using the Finite Element Method,” Heat Transfer Engineering, 07 2010. (SCI)
  20. DE-SHAU HUANG, JIYE-SIANG SHIH, HUNG-CHIH HSIA, MING-TZER, “Three-Phase Linear Motor Heat TransferAnalysis Using the Finite Element Method,” Heat Transfer Engineering, 07 2010. (SCI)