MEMs, VLSI technology Nano processing, Mechanical Properties of thin films and bioMEMs materials.
A. Journal Articles
De-Shau Huang, Yi-Sheng Liao, Heng-Jen Kuo, Fang-Jui Kuo, Ming-Tzer Lin, “Simulation of a high-power LED lamp for the evaluation and design,” Microsystem Technologies, 06 2015. (SCI)
YA-CHI CHENG,YU-TING WANG,FENG-CHIH HSU,FANG-CHING, “Effect of Loading Stress on the Growth of Cn/Sn Intermetallic Compounds at High Temperatures,” Journal of ELECTRONIC MATERIALS, 06 2015. (SCI)
Fan-Lei Wu,Sin-Liang Ou,Yu-Cheng Kao,Chun-Li Chen,Ming-Chun, “Thin-filmvertical-type AlGaInP LEDs fabricated by epitaxial lift-off process via thepatterned design of Cu substrate.,” OPTICS EXPRESS, vol.23, no.14, pp.18156-18165, 07 2015. (SCI)
Feng-Chih Hsu, Yu-Ting Wang, Ya-Chi Cheng, Chi-Jia Tong,and Ming-Tzer Lin, “The study of internal friction in nanocrystalline Ag and Au thin films,” Thin Solid Films, 11 2014. (SCI)
Yu-Ting Wang, Chi-Jia Tong, Yun-Fu Shieh, Ya-Chi Cheng, Fan-Chun Hsieh,, “Effect of temperature on energy loss and internal friction in nanocrystalline copper thin films.,” Surface & Coatings Technology, 12 2014. (SCI)
Hui Huang Cheng, De-Shau Huang, Ming-Tzer Lin, “Heat dissipation design and analysis of high power LED array using the finite element method,” Microelectronics Reliability, vol.52, 05 2012. (SCI)
Taco Chen,Ming-Tzer Lin Kuan-Jung Chung, “Linear energy control of laser drilling and its application in the repair of TFT-LCD bright pixels,” Microsystem Technologies, 11 2012. (SCI)
Yu-Ting Wang, Tien-Chen Hu,Chi-Jia Tong,Ming-Tzer Lin, “Novel full range vacuum pressure sensing technique using free decay of trapezoid micro-cantilever beam deflected by electrostatic force,” Microsystem Technologies, 11 2012. (SCI)
TIEN-CHEN HU,FENG-CHIH HSU, AN-WEN HUANG, and MING-TZER LIN, “Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates,” Journal of ELECTRONIC MATERIALS, vol.41, no.12, pp.3309-3319, 12 2012. (SCI)
Wei-Tzuo Lin, De-Shau Huang, *Ming-Tzer Lin, “The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications,” Microsystem Technologies, vol.17, pp.693-699, 04 2011. (SCI)
Ya-Chi Cheng, Chi-Jia Tong, Ming-Tzer Lin, “Measurement of Static and Dynamic Mechanical Behavior of Micro and Nano-Scale Thin Metal Films: Using Micro-Cantilever Beam Deflection,” Microsystem Technologies, vol.17, pp.721-730, 04 2011. (SCI)
Wen-Kai Liao, Chih-Ming Chen*, Ming-Tzer Lin and Chao-Hong Wang, “Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface,” Scripta Materialia, 08 2011. (SCI)
Ming-Tzer Lin; Chi Jia Tong; Kai ‐ ‐Shiang Shiu, “Novel microtensile method for monotonic and cyclic testing of freestanding copper thin films,” Experimental Mechanics, vol.50, pp.55-64, 01 2010. (SCI)
Chi-Jia Tong, Ya-Chi Cheng, *Ming-Tzer Lin, Kuan-Jung Chung, Jiong-Shiun, “Micro-Paddle Beam Deflection Measurement for Electrostatic Mechanical Testing of Nano-Scale Thin Film Application to MEMS,” Microsystem Technologies, vol.16, 07 2010. (SCI)
DE-SHAU HUANG, JIYE-SIANG SHIH, HUNG-CHIH HSIA, MING-TZER LIN, “Three-Phase Linear Motor Heat TransferAnalysis Using the Finite Element Method,” Heat Transfer Engineering, 07 2010. (SCI)
DE-SHAU HUANG, JIYE-SIANG SHIH, HUNG-CHIH HSIA, MING-TZER, “Three-Phase Linear Motor Heat TransferAnalysis Using the Finite Element Method,” Heat Transfer Engineering, 07 2010. (SCI)